Scratch device
High-precision and precise measurement! Automatically performs OK/NG judgment for defects based on any threshold setting.
The "Scratch Inspection Device" can accommodate multiple wafers and performs fully automated visual inspections for extremely small scratches, foreign substances, and chips. It is equipped with a laser displacement meter that automatically measures the distance to the workpiece, making it independent of the wafer thickness. In addition to image recording, it automatically determines OK/NG for defects based on user-defined threshold settings. It supports a wide range of applications, including transparent materials, semi-transparent SiC, GaN, GaAs, sapphire, and silicon. 【Features】 ■ Fully automated visual inspection for extremely small scratches, foreign substances, and chips ■ Equipped with a laser displacement meter that automatically measures the distance to the workpiece ■ The standard wafer size is 4 inches, with customization options available for up to 12 inches *For more details, please refer to the PDF document or feel free to contact us.
- Company:ソフトワークス
- Price:Other